Xiaomi Mi5 is said to come out with 5.5-inch Quad-HD resolution display, 4 GB of RAM, 16 MP or 20 MP rear camera, fingerprint reader, and USB-C. As for its processor, two chips are being linked: Snapdragon 820 or Helio X20.

A Weibo user Leaksfly reportedly published details about the upcoming Xiaomi Mi5. The user cited his sources as saying that the Mi5 will be unveiled on early November this year, and is tipped to come out with Qualcomm's Snapdragon 820, 5.5-inch Quad-HD resolution display, 4 GB of LPDDR4 RAM, 16 MP or 20 MP rear camera, fingerprint reader, and USB-C. Its thickness is just around 5.1mm.

With the Snapdragon 820, it would allow the Chinese company to have its upcoming flagship carrier to use Qualcomm's "ultrasonic fingerprint identification system," which is perceived to be an advantage because it won't need a capacitive sensor or a button present anywhere on Xiaomi Mi5's body to function.

However, others claim that Xiaomi might insert MediaTek's latest Helio X20 processors in the Mi5 as well as in the Mi Note Pro successor.

A leak showed a head-to-head comparison between Helio X20 and Snapdragon 820 processors. It showed:

Process:

• Helio X20: 20nm
• Snapdragon 820: 14nm

Apps CPU:

• Helio X20: Tri-cluster, 10-Core, Up to 2.5 GHz; 2x A72 2.3-2.5 GHz + 4x A53 2GHz + 4x A53 1.4 GHz
• Snapdragon 820: Dual-cluster, 4-Core up to 2.2 GHz; 2x Kyro 2.2 GHz + 2x Kyro 1.7 GHz

Memory:

• Helio X20: 2x LPDDR3 933MHz PoP
• Snapdragon 820: 2x LPDDR4 2100MHz PoP

Camera:

• Helio X20: 32MP@24fps (dual ISP); PDAF, VF8, Super Slow Motion, Native 3D 2.0
• Snapdragon 820: 28MP@30fps (dual ISP)

Video Decode:

• Helio X20: 4Kx2K 30fps 10-bit H.265/H.264/VP9
• Snapdragon 820: 4Kx2K 30fps H.265/H.264

Video Encode:

• Helio X20: 4Kx2K 30fps H.265 w/ HDR
• Snapdragon 820: 4Kx2K 30 fps H.265/H.264

Graphics:

• Helio X20: ARM Mali-T880 MP4 700MHz
• Snapdragon 820: Adreno 530 650MHz

Display:

• Helio X20: WQXGA 2560 x 1600 w/ 12 HW Blending layer; Full-HD 1920 x 1080 120Hz, MiraVision, ClearMotion
• Snapdragon 820: 4Kx2K 3840 x 2160

Modem:

• Helio X20: LTE FDD/TDD R11 Cat-6 with 20+20 CA; DC-HSPA+, TD-SCDMA/EDGE; CDMA2000 1x/EVDO Rev. A
• Snapdragon 820: LTE FDD/TDD R11 Cat-9 3xCA; DC-HSPA+, TD-SCDMA/EDGE; CDMA2000 1x/EVDO Rev. A

Connectivity:

• Helio X20: Integrated Wi-Fi 11ac/BT/FM/GPS/Glomas/Beiduo/ANT+
• Snapdragon: Extended Wi-Fi 2x2 11ac/BT/FM/GPS/Glomas/Beiduo

Only the Chinese company can decide as to which chip will they include in their flagship phone. Xiaomi Mi5 is set to be released around November. Readers should take these with a grain of salt as Xiaomi has yet to make official statements about the device.